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Revision as of 02:55, 30 March 2009 by Linux junkie (talk | contribs) (7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.)
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7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.

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current02:55, 30 March 2009Thumbnail for version as of 02:55, 30 March 20092,304 × 1,728 (866 KB)Linux junkie (talk | contribs)7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.

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